Technical Program Committee

Ethem Erkan Aktakka,

University of Michigan,
USA

David Arnold,

University of Florida,
USA

Adrien Badel,

Université Savoie Mont Blanc,
FRANCE

Skandar Basrour,

Grenoble Alpes Université,
FRANCE

Philippe Basset,

Université Paris-Est,
FRANCE

Mustafa Beyaz,

Antalya International University,
TURKEY

Danick Briand,

EPFL,
SWITZERLAND

Steve Burrow,

University of Bristol,
UK

Francesco Cottone,

University of Perugia,
ITALY

Derek Dunn-Rankin,

University of California, Irvine,
USA

Alper Erturk,

Georgia Tech,
USA

Luis Fonseca,

IMB-CNM (CSIC),
SPAIN

Takayuki Fujita,

University of Hyogo,
JAPAN

Dimitri Galayko,

UPMC-Sorbonne,
FRANCE

Tzeno Galchev,

Analog Devices, Inc.,
USA

Einar Halvorsen,

University College of Southeast Norway,
NORWAY

Andrew Holmes,

Imperial College London,
UK

Takashi Iijima,

National Institute of Advanced Industrial Science and Technology,
JAPAN

Isaku Kanno,

Kobe University,
JAPAN

Yoshihiro Kawahara,

The university of Tokyo,
JAPAN

Jongbaeg Kim,

Yonsei University,
KOREA

Jeffrey Lang,

MIT,
USA

Janet Ledesma-García,

Universidad Autónoma de Querétaro,
MEXICO

Carol Livermore,

Northeastern University,
USA

Yiannos Manoli,

University of Freiburg,
GERMANY

Jianmin Miao,

Nanyang Technological University,
SINGAPORE

Paul Mitcheson,

Imperial College London,
UK

Koji Miyazaki,

Kyushu Institute of Technology,
JAPAN

Kenichi Morimoto,

The University of Tokyo,
JAPAN

Masahiro Nomura,

The University of Tokyo,
JAPAN

Jaeyeong Park,

Kwangwoon University,
KOREA

Michael Renaud,

Arka Publishing,
INDONESIA

Paul Ronney,

University of Southern California,
USA

Shad Roundy,

University of Utah,
USA

Tomonori Seki,

OMRON Corporation,
JAPAN

Daisuke Shimokuri,

Hiroshima University,
JAPAN

Yuji Suzuki,

The University of Tokyo,
JAPAN

Shuji Tanaka,

Tohoku University,
JAPAN

Luis Fernando Velásquez-García,

Massachusetts Institute of Technology, USA

Xiaohong Wang,

Tsinghua University,
CHINA

Peter Woias,

University of Freiburg, IMTEK,
GERMANY





Power MEMS 2017

c/o Echizen & Associates,
Tokan Shinjuku Bldg., 603 Nishi-Shinjuku 3-6-5, Shinjuku, Tokyo, 160-0023 Japan
phone: +81-3-3346-8007 fax: +81-3-3346-8002